Tetrakis(dimethylsilyl)silane
≥95%
- Product Code: 88554
CAS:
2003-85-2
| Molecular Weight: | 264.74 g./mol | Molecular Formula: | C₈H₂₈Si₅ |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD01631315 | |
| Melting Point: | Boiling Point: | ||
| Density: | Storage Condition: | 2-8°C |
Product Description:
This chemical is primarily used in the field of materials science, particularly in the development of silicon-based polymers and coatings. It serves as a precursor for creating silicon carbide and silicon nitride materials, which are essential in high-temperature and high-strength applications. Additionally, it is employed in the synthesis of organosilicon compounds, which are widely used in sealants, adhesives, and lubricants due to their thermal stability and water resistance. Its role in semiconductor manufacturing is also notable, where it contributes to the deposition of thin films and the production of advanced electronic components. Furthermore, it finds application in research and development for exploring new silicon-based materials with unique properties.
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 0.250 | 10-20 days | ฿7,820.00 |
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Tetrakis(dimethylsilyl)silane
This chemical is primarily used in the field of materials science, particularly in the development of silicon-based polymers and coatings. It serves as a precursor for creating silicon carbide and silicon nitride materials, which are essential in high-temperature and high-strength applications. Additionally, it is employed in the synthesis of organosilicon compounds, which are widely used in sealants, adhesives, and lubricants due to their thermal stability and water resistance. Its role in semiconductor manufacturing is also notable, where it contributes to the deposition of thin films and the production of advanced electronic components. Furthermore, it finds application in research and development for exploring new silicon-based materials with unique properties.
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