AMINOPROPYLSILANETRIOL
97%
- Product Code: 88605
CAS:
29159-37-3
Molecular Weight: | 137.21 g./mol | Molecular Formula: | C₃H₁₁NO₃Si |
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EC Number: | MDL Number: | ||
Melting Point: | -1 °C | Boiling Point: | 100 °C |
Density: | 1.06 g/cm3 | Storage Condition: | 2-8°C, sealed, dry |
Product Description:
Aminopropylsilanetriol is widely used as a coupling agent in various industrial applications. It enhances the adhesion between organic polymers and inorganic materials, making it valuable in the production of composites, coatings, and adhesives. In the construction industry, it is incorporated into concrete and cement formulations to improve durability and water resistance. It is also utilized in the manufacturing of glass fibers and ceramics to strengthen the bond between the fibers and the matrix. Additionally, it finds application in surface treatment processes to modify the properties of materials, such as increasing hydrophobicity or improving chemical resistance. In the electronics industry, it is used to improve the performance of encapsulants and coatings for electronic components. Its versatility makes it a key component in advanced material science and engineering.
Sizes / Availability / Pricing:
Size (g) | Availability | Price | Quantity |
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100.000 | 10-20 days | ฿6,300.00 |
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AMINOPROPYLSILANETRIOL
Aminopropylsilanetriol is widely used as a coupling agent in various industrial applications. It enhances the adhesion between organic polymers and inorganic materials, making it valuable in the production of composites, coatings, and adhesives. In the construction industry, it is incorporated into concrete and cement formulations to improve durability and water resistance. It is also utilized in the manufacturing of glass fibers and ceramics to strengthen the bond between the fibers and the matrix. Additionally, it finds application in surface treatment processes to modify the properties of materials, such as increasing hydrophobicity or improving chemical resistance. In the electronics industry, it is used to improve the performance of encapsulants and coatings for electronic components. Its versatility makes it a key component in advanced material science and engineering.
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