Poly(Hydridosilsesquioxane)
average Mw 3000-5000
- Product Code: 88614
CAS:
137125-44-1
| Molecular Weight: | Molecular Formula: | HSiO₁₅ | |
|---|---|---|---|
| EC Number: | MDL Number: | ||
| Melting Point: | Boiling Point: | ||
| Density: | 0.88 g/cm3 | Storage Condition: | 2-8°C, sealed, dry |
Product Description:
Used as a key component in the production of low-dielectric constant materials for microelectronics, enhancing the performance of semiconductor devices by reducing signal delay and power consumption. It serves as a protective coating for optical fibers, improving their durability and resistance to environmental factors. Applied in the formulation of advanced adhesives and sealants, providing excellent thermal stability and moisture resistance. Utilized in the development of high-performance ceramics and composites, offering superior mechanical properties and heat resistance. Employed in the creation of hydrophobic surfaces for various industrial applications, ensuring water repellency and corrosion protection.
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 10.000 | 10-20 days | ฿67,500.00 |
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Poly(Hydridosilsesquioxane)
Used as a key component in the production of low-dielectric constant materials for microelectronics, enhancing the performance of semiconductor devices by reducing signal delay and power consumption. It serves as a protective coating for optical fibers, improving their durability and resistance to environmental factors. Applied in the formulation of advanced adhesives and sealants, providing excellent thermal stability and moisture resistance. Utilized in the development of high-performance ceramics and composites, offering superior mechanical properties and heat resistance. Employed in the creation of hydrophobic surfaces for various industrial applications, ensuring water repellency and corrosion protection.
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