POLY(PHENYL-METHYLSILSESQUIOXANE)

97%

  • Product Code: 88619
  CAS:    181186-29-8
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Melting Point: Boiling Point: 137 °C
Density: 0.92 g/cm3 Storage Condition: 2-8°C, sealed, dry
Product Description: Poly(phenyl-methylsilsesquioxane) is widely used in the coatings industry due to its excellent thermal stability and resistance to oxidation. It is often applied as a protective layer for surfaces exposed to high temperatures, such as in aerospace components and industrial machinery. Additionally, its hydrophobic properties make it suitable for water-repellent coatings on fabrics, glass, and metals. In electronics, this polymer is utilized as an insulating material in microelectronic devices, providing both electrical insulation and thermal management. Its compatibility with various substrates and ability to form thin, uniform films also make it valuable in the production of optical coatings, enhancing the durability and performance of lenses and mirrors. Furthermore, it is employed in the formulation of high-performance resins and adhesives, offering improved mechanical strength and chemical resistance in demanding applications.
Sizes / Availability / Pricing:
Size (g) Availability Price Quantity
100.000 10-20 days Ft223,024.04
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POLY(PHENYL-METHYLSILSESQUIOXANE)
Poly(phenyl-methylsilsesquioxane) is widely used in the coatings industry due to its excellent thermal stability and resistance to oxidation. It is often applied as a protective layer for surfaces exposed to high temperatures, such as in aerospace components and industrial machinery. Additionally, its hydrophobic properties make it suitable for water-repellent coatings on fabrics, glass, and metals. In electronics, this polymer is utilized as an insulating material in microelectronic devices, providing both electrical insulation and thermal management. Its compatibility with various substrates and ability to form thin, uniform films also make it valuable in the production of optical coatings, enhancing the durability and performance of lenses and mirrors. Furthermore, it is employed in the formulation of high-performance resins and adhesives, offering improved mechanical strength and chemical resistance in demanding applications.
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