Poly(AminophenylSilesquioxane)

95%

  • Product Code: 88620
  Alias:    Octa(aminophenyl)-T8-silsesquioxane; Aminophenylsilsesquioxane; Octa(aminophenyltrioxysilane); Octa-p-aminophenyl-POSS
  CAS:    518359-82-5
Molecular Weight: 1153.64 g./mol Molecular Formula: C₄₈H₄₈N₈O₁₂Si₈
EC Number: MDL Number: MFCD08275349
Melting Point: Boiling Point:
Density: Storage Condition: 2~8℃, sealed
Product Description: Poly(aminophenylsilsesquioxane) is widely used in the field of advanced materials due to its unique properties. It is commonly applied as a high-performance resin in coatings and composites, offering excellent thermal stability and mechanical strength. This makes it suitable for use in aerospace and automotive industries, where materials must withstand extreme conditions. Additionally, its amine functional groups enable it to act as a crosslinking agent in epoxy resins, enhancing adhesion and durability in protective coatings. It is also utilized in electronic applications, such as insulating materials, due to its dielectric properties and resistance to heat. Furthermore, its compatibility with other polymers allows for the development of hybrid materials with tailored functionalities for specific industrial needs.
Product Specification:
Test Specification
Purity 95 100%
Appearance White to yellow to grey crystalline powder
Infrared spectrum Conforms to Structure
Sizes / Availability / Pricing:
Size (g) Availability Price Quantity
0.250 10-20 days $358.80
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1.000 10-20 days $1,074.54
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5.000 10-20 days $3,616.23
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Poly(AminophenylSilesquioxane)
Poly(aminophenylsilsesquioxane) is widely used in the field of advanced materials due to its unique properties. It is commonly applied as a high-performance resin in coatings and composites, offering excellent thermal stability and mechanical strength. This makes it suitable for use in aerospace and automotive industries, where materials must withstand extreme conditions. Additionally, its amine functional groups enable it to act as a crosslinking agent in epoxy resins, enhancing adhesion and durability in protective coatings. It is also utilized in electronic applications, such as insulating materials, due to its dielectric properties and resistance to heat. Furthermore, its compatibility with other polymers allows for the development of hybrid materials with tailored functionalities for specific industrial needs.
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