Stannous methanesulfonate
50 wt. % in H2O
- Product Code: 88847
CAS:
53408-94-9
| Molecular Weight: | 308.91 g./mol | Molecular Formula: | C₂H₆O₆S₂Sn |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD00137737 | |
| Melting Point: | −27 °C | Boiling Point: | |
| Density: | 1.55 g/mL at 25 °C | Storage Condition: | room temperature |
Product Description:
Widely used in the electronics industry as a key component in electroplating processes, particularly for depositing tin or tin alloy coatings on various substrates. It ensures excellent solderability, corrosion resistance, and uniform coating thickness, making it ideal for manufacturing printed circuit boards (PCBs) and semiconductor devices. Additionally, it is employed in the production of lithium-ion batteries, where it enhances the performance and durability of battery components. Its stability and efficiency in acidic environments make it a preferred choice for industrial applications requiring precise and reliable metal deposition.
Product Specification:
| Test | Specification |
|---|---|
| CONCENTRATION | 49-51 |
| Appearance | Clear colorless liquid |
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 25.000 | 10-20 days | ฿580.00 |
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| 100.000 | 10-20 days | ฿1,490.00 |
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| 500.000 | 10-20 days | ฿4,580.00 |
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| 2500.000 | 10-20 days | ฿16,990.00 |
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| 10000.000 | 10-20 days | ฿50,970.00 |
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Stannous methanesulfonate
Widely used in the electronics industry as a key component in electroplating processes, particularly for depositing tin or tin alloy coatings on various substrates. It ensures excellent solderability, corrosion resistance, and uniform coating thickness, making it ideal for manufacturing printed circuit boards (PCBs) and semiconductor devices. Additionally, it is employed in the production of lithium-ion batteries, where it enhances the performance and durability of battery components. Its stability and efficiency in acidic environments make it a preferred choice for industrial applications requiring precise and reliable metal deposition.
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