Triphenyl Borate

≥96%

  • Product Code: 91196
  CAS:    1095-03-0
Molecular Weight: 290.13 g./mol Molecular Formula: C₁₈H₁₅BO₃
EC Number: MDL Number: MFCD00059011
Melting Point: 101°C(lit.) Boiling Point:
Density: Storage Condition: 2-8°C
Product Description: Triphenyl borate is widely used as a stabilizing agent and intermediate in the synthesis of various organic compounds. It finds application in the production of flame retardants, where it enhances the fire resistance of materials such as plastics and textiles. Additionally, it serves as a catalyst in esterification and transesterification reactions, improving the efficiency of these processes in the manufacture of polymers and resins. In the field of coatings and adhesives, triphenyl borate acts as a cross-linking agent, contributing to improved durability and performance. It is also utilized in the development of specialty chemicals for electronics, particularly in the formulation of dielectric materials and semiconductor coatings.
Product Specification:
Test Specification
APPEARANCE White to Light yellow powder to crystal
PURITY 96-100
Boric acid max. 2.0 %
Infrared spectrum Conforms to Structure
Sizes / Availability / Pricing:
Size (g) Availability Price Quantity
5.000 10-20 days ฿770.00
+
-
25.000 10-20 days ฿2,300.00
+
-
100.000 10-20 days ฿6,980.00
+
-
500.000 10-20 days ฿28,380.00
+
-
Triphenyl Borate
Triphenyl borate is widely used as a stabilizing agent and intermediate in the synthesis of various organic compounds. It finds application in the production of flame retardants, where it enhances the fire resistance of materials such as plastics and textiles. Additionally, it serves as a catalyst in esterification and transesterification reactions, improving the efficiency of these processes in the manufacture of polymers and resins. In the field of coatings and adhesives, triphenyl borate acts as a cross-linking agent, contributing to improved durability and performance. It is also utilized in the development of specialty chemicals for electronics, particularly in the formulation of dielectric materials and semiconductor coatings.
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