Octakis(trimethylsiloxy)silsesquioxane
- Product Code: 94509
Alias:
Trimethylsilyl clathrate polysilsesquioxane; octabis(trimethylsiloxane)silsesquioxane
CAS:
51777-38-9
| Molecular Weight: | 829.76 g./mol | Molecular Formula: | C₂₄H₇₂O₁₀Si₁₁ |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD01310212 | |
| Melting Point: | Boiling Point: | ||
| Density: | Storage Condition: | Room temperature, airtight, dry |
Product Description:
Used in the production of advanced materials, particularly in coatings and composites, where it enhances thermal stability and mechanical strength. It is also employed in the formulation of high-performance lubricants, reducing friction and wear in mechanical systems. Additionally, it serves as a key component in the development of hydrophobic surfaces, improving water repellency in various applications. In electronics, it is utilized as a dielectric material, contributing to the insulation and performance of electronic devices. Its unique structure makes it valuable in nanotechnology, aiding in the creation of nanostructured materials with tailored properties.
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 1.000 | 10-20 days | ฿2,460.00 |
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| 5.000 | 10-20 days | ฿8,660.00 |
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Octakis(trimethylsiloxy)silsesquioxane
Used in the production of advanced materials, particularly in coatings and composites, where it enhances thermal stability and mechanical strength. It is also employed in the formulation of high-performance lubricants, reducing friction and wear in mechanical systems. Additionally, it serves as a key component in the development of hydrophobic surfaces, improving water repellency in various applications. In electronics, it is utilized as a dielectric material, contributing to the insulation and performance of electronic devices. Its unique structure makes it valuable in nanotechnology, aiding in the creation of nanostructured materials with tailored properties.
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