3-[[Dimethyl(vinyl)silyl]oxy]-1,1,5,5-tetramethyl-3-phenyl-1,5-divinyltrisiloxane
≥98%
- Product Code: 94985
CAS:
60111-47-9
| Molecular Weight: | 408.79 g./mol | Molecular Formula: | C₁₈H₃₂O₃Si₄ |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD00156495 | |
| Melting Point: | Boiling Point: | ||
| Density: | Storage Condition: | room temperature, dry |
Product Description:
This chemical is primarily used in the formulation of advanced silicone-based materials, particularly in the production of high-performance coatings and adhesives. Its unique structure allows it to enhance the flexibility, durability, and thermal stability of silicone polymers, making it suitable for applications in harsh environments. It is also utilized in the development of release agents for industrial processes, where it provides excellent non-stick properties. Additionally, it finds use in the electronics industry as a component in encapsulants and sealants, offering protection against moisture and mechanical stress. Its compatibility with various substrates and its ability to improve surface properties make it valuable in specialized manufacturing and material science applications.
Product Specification:
| Test | Specification |
|---|---|
| APPEARANCE | Colorless to Almost colorless clear liquid |
| PURITY | 97.5-100 |
| Infrared spectrum | Conforms to Structure |
| NMR | Conforms to Structure |
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 1.000 | 10-20 days | ฿2,600.00 |
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| 5.000 | 10-20 days | ฿7,280.00 |
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3-[[Dimethyl(vinyl)silyl]oxy]-1,1,5,5-tetramethyl-3-phenyl-1,5-divinyltrisiloxane
This chemical is primarily used in the formulation of advanced silicone-based materials, particularly in the production of high-performance coatings and adhesives. Its unique structure allows it to enhance the flexibility, durability, and thermal stability of silicone polymers, making it suitable for applications in harsh environments. It is also utilized in the development of release agents for industrial processes, where it provides excellent non-stick properties. Additionally, it finds use in the electronics industry as a component in encapsulants and sealants, offering protection against moisture and mechanical stress. Its compatibility with various substrates and its ability to improve surface properties make it valuable in specialized manufacturing and material science applications.
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