9,9-Bis(4-glycidyloxy-3-methylphenyl)fluorene
≥97%
- Product Code: 95023
CAS:
114205-89-9
| Molecular Weight: | 490.6 g./mol | Molecular Formula: | C₃₃H₃₀O₄ |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD22494984 | |
| Melting Point: | Boiling Point: | ||
| Density: | Storage Condition: | room temperature, dry |
Product Description:
This chemical is primarily used as an epoxy resin precursor in the production of high-performance coatings and adhesives. Its structure provides excellent thermal stability, chemical resistance, and mechanical strength, making it suitable for applications in the aerospace, automotive, and electronics industries. It is often employed in the formulation of advanced composite materials, where durability and resistance to harsh environments are critical. Additionally, it is utilized in the development of encapsulants for electronic components, ensuring protection against moisture, heat, and mechanical stress. Its ability to form strong, stable bonds also makes it valuable in the creation of specialty coatings for industrial equipment and infrastructure.
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 0.200 | 10-20 days | ฿2,310.00 |
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| 1.000 | 10-20 days | ฿7,900.00 |
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9,9-Bis(4-glycidyloxy-3-methylphenyl)fluorene
This chemical is primarily used as an epoxy resin precursor in the production of high-performance coatings and adhesives. Its structure provides excellent thermal stability, chemical resistance, and mechanical strength, making it suitable for applications in the aerospace, automotive, and electronics industries. It is often employed in the formulation of advanced composite materials, where durability and resistance to harsh environments are critical. Additionally, it is utilized in the development of encapsulants for electronic components, ensuring protection against moisture, heat, and mechanical stress. Its ability to form strong, stable bonds also makes it valuable in the creation of specialty coatings for industrial equipment and infrastructure.
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