1,6-Hexanediol diacrylate

90%

  • Product Code: 95094
  Alias:    1,6-Hexanediol Diacrylate ;1,4-Hexanediol Diacrylate
  CAS:    13048-33-4
Molecular Weight: 226.27 g./mol Molecular Formula: C₁₂H₁₈O₄
EC Number: 235-921-9 MDL Number: MFCD00008631
Melting Point: 6°C Boiling Point:
Density: 1.01 g/mL at 25 °C(lit.) Storage Condition: room temperature
Product Description: 1,6-Hexanediol diacrylate is primarily used as a crosslinking agent in the production of polymers and resins. It is widely applied in the formulation of UV-curable coatings, inks, and adhesives, where it enhances the durability, hardness, and chemical resistance of the final product. In the electronics industry, it is utilized in the manufacture of photoresists and printed circuit boards due to its ability to form strong, stable networks upon exposure to ultraviolet light. Additionally, it finds applications in dental materials, where it contributes to the strength and longevity of composite resins used in restorative dentistry. Its versatility also extends to the production of 3D printing resins, where it improves the mechanical properties and precision of printed objects.
Product Specification:
Test Specification
PurityGC 90 100%
REFRACTIVE INDEX N20D 1.456-1.46
SPECIFIC GRAVITY 2020 1.022-1.026
APPEARANCE COLORLESS LIQUID
INFRARED SPECTRUM Conforms to Structure
PROTON NMR SPECTRUM Conforms to Structure
NOTE: This product is low melting point solid,may change state in different environments (solid, liquid or semi-solid)
Sizes / Availability / Pricing:
Size (g) Availability Price Quantity
25.000 10-20 days ฿390.00
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100.000 10-20 days ฿1,010.00
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-
500.000 10-20 days ฿3,800.00
+
-
2500.000 10-20 days ฿15,160.00
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-
1,6-Hexanediol diacrylate
1,6-Hexanediol diacrylate is primarily used as a crosslinking agent in the production of polymers and resins. It is widely applied in the formulation of UV-curable coatings, inks, and adhesives, where it enhances the durability, hardness, and chemical resistance of the final product. In the electronics industry, it is utilized in the manufacture of photoresists and printed circuit boards due to its ability to form strong, stable networks upon exposure to ultraviolet light. Additionally, it finds applications in dental materials, where it contributes to the strength and longevity of composite resins used in restorative dentistry. Its versatility also extends to the production of 3D printing resins, where it improves the mechanical properties and precision of printed objects.
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