Dibromopyromellitic Dianhydride
≥98%
- Product Code: 95099
CAS:
24848-78-0
| Molecular Weight: | 375.91 g./mol | Molecular Formula: | C₁₀Br₂O₆ |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD01100205 | |
| Melting Point: | 275°C(lit.) | Boiling Point: | |
| Density: | Storage Condition: | room temperature, dry |
Product Description:
Used primarily as a reactive intermediate in the synthesis of high-performance polymers, particularly polyimides. These polymers are valued for their thermal stability, mechanical strength, and chemical resistance, making them suitable for applications in the electronics industry, such as in the production of flexible printed circuit boards, insulating films, and semiconductor coatings. Additionally, it can be employed in the development of advanced adhesives and coatings that require durability under extreme conditions, such as in aerospace or automotive industries. Its incorporation into materials enhances their ability to withstand high temperatures and harsh environments.
Product Specification:
| Test | Specification |
|---|---|
| APPEARANCE | solid |
| PURITY | 97.5-100 |
| Infrared spectrum | Conforms to Structure |
| NMR | Conforms to Structure |
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 0.200 | 10-20 days | ฿3,770.00 |
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| 1.000 | 10-20 days | ฿11,180.00 |
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Dibromopyromellitic Dianhydride
Used primarily as a reactive intermediate in the synthesis of high-performance polymers, particularly polyimides. These polymers are valued for their thermal stability, mechanical strength, and chemical resistance, making them suitable for applications in the electronics industry, such as in the production of flexible printed circuit boards, insulating films, and semiconductor coatings. Additionally, it can be employed in the development of advanced adhesives and coatings that require durability under extreme conditions, such as in aerospace or automotive industries. Its incorporation into materials enhances their ability to withstand high temperatures and harsh environments.
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