Neopentyl glycol diglycidyl ether
40.0%
- Product Code: 95131
Alias:
Neopentyl glycol diglycidyl ether
CAS:
17557-23-2
| Molecular Weight: | 216.27 g./mol | Molecular Formula: | C₁₁H₂₀O₄ |
|---|---|---|---|
| EC Number: | 241-536-7 | MDL Number: | MFCD00040687 |
| Melting Point: | Boiling Point: | 103-107 °C1 mm Hg(lit.) | |
| Density: | 1.04 g/mL at 25 °C(lit.) | Storage Condition: | room temperature |
Product Description:
Neopentyl glycol diglycidyl ether is widely used as a reactive diluent in epoxy resin formulations. Its primary application is to reduce the viscosity of epoxy systems, making them easier to handle and process while maintaining excellent mechanical and chemical properties. This chemical is particularly valuable in coatings, adhesives, and composite materials, where it enhances flexibility and adhesion. It also contributes to improved thermal stability and resistance to environmental factors such as moisture and chemicals. In the electronics industry, it is utilized in encapsulants and potting compounds to protect sensitive components. Additionally, it finds use in the production of high-performance laminates and fiber-reinforced plastics, where it ensures optimal curing and durability.
Product Specification:
| Test | Specification |
|---|---|
| PurityGC | 40 100% |
| INFRARED SPECTRUM | Conforms to Structure |
| APPEARANCE | COLORLESS LIQUID |
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 5.000 | 10-20 days | Ft3,770.94 |
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| 25.000 | 10-20 days | Ft9,912.18 |
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| 100.000 | 10-20 days | Ft24,672.71 |
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| 500.000 | 10-20 days | Ft93,627.00 |
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| 2500.000 | 10-20 days | Ft280,126.81 |
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Neopentyl glycol diglycidyl ether
Neopentyl glycol diglycidyl ether is widely used as a reactive diluent in epoxy resin formulations. Its primary application is to reduce the viscosity of epoxy systems, making them easier to handle and process while maintaining excellent mechanical and chemical properties. This chemical is particularly valuable in coatings, adhesives, and composite materials, where it enhances flexibility and adhesion. It also contributes to improved thermal stability and resistance to environmental factors such as moisture and chemicals. In the electronics industry, it is utilized in encapsulants and potting compounds to protect sensitive components. Additionally, it finds use in the production of high-performance laminates and fiber-reinforced plastics, where it ensures optimal curing and durability.
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