Poly(4-vinylphenol)
Mw ~11,000
- Product Code: 95710
CAS:
24979-70-2
Molecular Weight: | Molecular Formula: | CH₂CHC₆H₄OH | |
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EC Number: | MDL Number: | MFCD00147948 | |
Melting Point: | 360 °C | Boiling Point: | |
Density: | Storage Condition: | Room temperature, airtight, dry |
Product Description:
Poly(4-vinylphenol) is widely used as a key component in the production of photoresists, which are essential in the semiconductor industry for creating microelectronic devices. Its excellent film-forming properties and chemical resistance make it suitable for use in lithographic processes, where it helps in transferring intricate patterns onto silicon wafers.
In the field of organic electronics, it serves as a dielectric material in organic thin-film transistors (OTFTs). Its high dielectric constant and compatibility with flexible substrates enhance the performance and stability of these devices, making it valuable for applications in flexible displays and sensors.
Additionally, it is utilized as a binder or additive in coatings and adhesives, where its thermal stability and adhesion properties improve the durability and performance of the final products. Its ability to form strong, uniform films also makes it suitable for use in protective coatings and encapsulation materials.
Product Specification:
Test | Specification |
---|---|
APPEARANCE | White to Light Yellow and Light Beige to Beige powder |
AVERAGE MOLECULAR WEIGHT | 9900-11900 |
WATER | 0 3 % |
Infrared spectrum | Conforms to Structure |
Sizes / Availability / Pricing:
Size (g) | Availability | Price | Quantity |
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1.000 | 10-20 days | ฿1,820.00 |
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5.000 | 10-20 days | ฿7,880.00 |
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Poly(4-vinylphenol)
Poly(4-vinylphenol) is widely used as a key component in the production of photoresists, which are essential in the semiconductor industry for creating microelectronic devices. Its excellent film-forming properties and chemical resistance make it suitable for use in lithographic processes, where it helps in transferring intricate patterns onto silicon wafers.
In the field of organic electronics, it serves as a dielectric material in organic thin-film transistors (OTFTs). Its high dielectric constant and compatibility with flexible substrates enhance the performance and stability of these devices, making it valuable for applications in flexible displays and sensors.
Additionally, it is utilized as a binder or additive in coatings and adhesives, where its thermal stability and adhesion properties improve the durability and performance of the final products. Its ability to form strong, uniform films also makes it suitable for use in protective coatings and encapsulation materials.
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