n-Hexylphosphonic acid
98%
- Product Code: 194528
CAS:
4721-24-8
| Molecular Weight: | 166.16 g./mol | Molecular Formula: | C₆H₁₃P(O)(OH)₂ |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD00013961 | |
| Melting Point: | 108-110°C | Boiling Point: | 299.7ºC at 760 mmHg |
| Density: | 1.132 | Storage Condition: | Room temperature, seal, dry |
Product Description:
Used as a surface modifier in semiconductor and electronic materials processing, particularly in the fabrication of organic thin-film transistors (OTFTs). It helps improve interface properties by forming self-assembled monolayers on metal oxides, enhancing device performance through reduced interfacial defects and better charge transport. Also employed in corrosion inhibition and as a ligand in nanoparticle synthesis due to its strong binding affinity to metal surfaces. Its hydrophobic nature contributes to moisture resistance in coatings and protective films.
Sizes / Availability / Pricing:
| Size | Availability | Price | Quantity |
|---|---|---|---|
| 1g | 10-20 days | ฿300.00 |
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| 5g | 10-20 days | ฿450.00 |
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| 100g | 10-20 days | ฿4,590.00 |
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| 500g | 10-20 days | ฿22,000.00 |
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| 25g | 10-20 days | ฿1,530.00 |
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n-Hexylphosphonic acid
Used as a surface modifier in semiconductor and electronic materials processing, particularly in the fabrication of organic thin-film transistors (OTFTs). It helps improve interface properties by forming self-assembled monolayers on metal oxides, enhancing device performance through reduced interfacial defects and better charge transport. Also employed in corrosion inhibition and as a ligand in nanoparticle synthesis due to its strong binding affinity to metal surfaces. Its hydrophobic nature contributes to moisture resistance in coatings and protective films.
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