Neopentyl Glycol Bis(4-aminophenyl) Ether

≥97%

Reagent Code: #122721
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CAS Number 115570-52-0

blur_circular Chemical Specifications

scatter_plot Molecular Information
Weight 286.38 g/mol
Formula C₁₇H₂₂N₂O₂
badge Registry Numbers
MDL Number MFCD00671569
thermostat Physical Properties
Melting Point 115-119°C
inventory_2 Storage & Handling
Storage room temperature

description Product Description

Neopentyl Glycol Bis(4-aminophenyl) Ether is primarily utilized in the synthesis of high-performance polymers and resins. It serves as a key monomer in the production of polyimides, which are known for their exceptional thermal stability, mechanical strength, and chemical resistance. These polyimides are widely used in the electronics industry for manufacturing flexible printed circuit boards, insulating films, and coatings for semiconductors. Additionally, the compound is employed in the development of epoxy resins, enhancing their durability and heat resistance, making them suitable for aerospace, automotive, and industrial applications. Its role in creating advanced materials contributes significantly to innovations in high-temperature and high-stress environments.

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Test Parameter Specification
Appearance White to light yellow to light orange to brown powder to crystals
Purity (%) 96.5-100%
Melting Point (°C) 115-119
Infrared Spectrum Conforms To Structure
NMR Conforms To Structure

shopping_cart Available Sizes & Pricing

Size Availability Unit Price Quantity
inventory 1g
10-20 days £20.40
inventory 5g
10-20 days £41.04
inventory 25g
10-20 days £159.33
Neopentyl Glycol Bis(4-aminophenyl) Ether
Neopentyl Glycol Bis(4-aminophenyl) Ether is primarily utilized in the synthesis of high-performance polymers and resins. It serves as a key monomer in the production of polyimides, which are known for their exceptional thermal stability, mechanical strength, and chemical resistance. These polyimides are widely used in the electronics industry for manufacturing flexible printed circuit boards, insulating films, and coatings for semiconductors. Additionally, the compound is employed in the development of epoxy resins, enhancing their durability and heat resistance, making them suitable for aerospace, automotive, and industrial applications. Its role in creating advanced materials contributes significantly to innovations in high-temperature and high-stress environments.
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