Dimethoxydiphenylsilane
98%
- Product Code: 88457
Alias:
Diphenyldimethoxysilane; Dimethoxydiphenylsilane
CAS:
6843-66-9
Molecular Weight: | 244.36 g./mol | Molecular Formula: | C₁₄H₁₆O₂Si |
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EC Number: | 229-929-1 | MDL Number: | MFCD00025690 |
Melting Point: | Boiling Point: | 161 °C15 mm Hg(lit.) | |
Density: | 1.08 g/mL at 20 °C(lit.) | Storage Condition: | Room temperature, inert gas atmosphere |
Product Description:
Dimethoxydiphenylsilane is widely used in the synthesis of silicone polymers and resins, where it acts as a key intermediate. Its application extends to the production of coatings and adhesives, providing enhanced thermal stability and water resistance. In the electronics industry, it is utilized in the manufacture of dielectric materials and encapsulants for semiconductors, offering excellent insulating properties. Additionally, it serves as a surface modifier in the treatment of glass and ceramics, improving their adhesion and durability. The compound is also employed in the preparation of organosilicon compounds, which are essential in various industrial and research applications.
Product Specification:
Test | Specification |
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PurityGC | 98-100 |
REFRACTIVE INDEX N20D | 1.540-1.545 |
SPECIFIC GRAVITY 2020C | 1.078-1.081 |
APPEARANCE | Colorless to Very Faint Yellow Liquid |
INFRARED SPECTRUM | Conforms to Structure |
Sizes / Availability / Pricing:
Size (g) | Availability | Price | Quantity |
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25.000 | 10-20 days | ฿310.00 |
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100.000 | 10-20 days | ฿860.00 |
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500.000 | 10-20 days | ฿3,260.00 |
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2500.000 | 10-20 days | ฿14,520.00 |
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Dimethoxydiphenylsilane
Dimethoxydiphenylsilane is widely used in the synthesis of silicone polymers and resins, where it acts as a key intermediate. Its application extends to the production of coatings and adhesives, providing enhanced thermal stability and water resistance. In the electronics industry, it is utilized in the manufacture of dielectric materials and encapsulants for semiconductors, offering excellent insulating properties. Additionally, it serves as a surface modifier in the treatment of glass and ceramics, improving their adhesion and durability. The compound is also employed in the preparation of organosilicon compounds, which are essential in various industrial and research applications.
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