Used as a reducing agent in electroless plating processes, particularly for depositing nickel and copper onto surfaces without an external electrical current. It helps in creating uniform, corrosion-resistant coatings on metals, plastics, and printed circuit boards. Also employed in chemical synthesis where mild reduction is required, and in some cases, as a stabilizer or scavenger for oxygen in industrial water systems to prevent oxidation. Its reducing properties make it valuable in analytical chemistry for selective reduction reactions.