Used as a high-performance curing agent and crosslinking agent in epoxy resin systems, particularly in aerospace, electronics, and composite materials. Its extended aromatic structure provides excellent thermal stability and mechanical strength, making it ideal for advanced composites requiring high glass transition temperatures (Tg). Commonly applied in structural adhesives, encapsulants, and printed circuit boards where durability under thermal stress is critical. Also utilized in specialty polymers for its ability to enhance flame resistance and dimensional stability.