Used as a high-performance diamine monomer in the synthesis of specialty polyimides and polyamides. Its fluorinated structure enhances solubility in organic solvents and improves processability while maintaining thermal stability. The allyl groups enable crosslinking reactions, making it suitable for thermosetting resins used in electronic encapsulation and advanced composite materials. Commonly applied in aerospace, microelectronics, and optoelectronic devices due to its low dielectric constant and excellent mechanical properties. Also utilized in coatings requiring chemical resistance and thermal durability.