Ethylene Glycol Bis(2-aminophenyl) Ether

97%

Reagent Code: #183057
label
Alias 2,2'-[ethane-1,2-diylbis(oxy)]dipaniline; 1,2-bis(2-aminophenoxy)ethane
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CAS Number 52411-34-4

science Other reagents with same CAS 52411-34-4

blur_circular Chemical Specifications

scatter_plot Molecular Information
Weight 244.29 g/mol
Formula C₁₄H₁₆N₂O₂
badge Registry Numbers
MDL Number MFCD00087648
thermostat Physical Properties
Melting Point 133°C
Boiling Point 225°C/0.1kPa
inventory_2 Storage & Handling
Storage 2-8°C

description Product Description

Used as a specialty curing agent and crosslinking agent in epoxy resin systems, particularly in high-performance coatings, adhesives, and composite materials. Its aromatic amine structure provides excellent thermal stability and mechanical strength to cured resins. Commonly applied in aerospace, electronics, and structural adhesives where durability under elevated temperatures and harsh environments is required. Also utilized in the synthesis of specialty polymers and as a ligand in certain catalytic applications due to its donor properties.

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Size Availability Unit Price Quantity
inventory 1g
10-20 days ฿174.00
inventory 5g
10-20 days ฿181.50
inventory 25g
10-20 days ฿1,360.00
inventory 100g
10-20 days ฿2,640.00

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Ethylene Glycol Bis(2-aminophenyl) Ether
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Used as a specialty curing agent and crosslinking agent in epoxy resin systems, particularly in high-performance coatings, adhesives, and composite materials. Its aromatic amine structure provides excellent thermal stability and mechanical strength to cured resins. Commonly applied in aerospace, electronics, and structural adhesives where durability under elevated temperatures and harsh environments is required. Also utilized in the synthesis of specialty polymers and as a ligand in certain catalytic app

Used as a specialty curing agent and crosslinking agent in epoxy resin systems, particularly in high-performance coatings, adhesives, and composite materials. Its aromatic amine structure provides excellent thermal stability and mechanical strength to cured resins. Commonly applied in aerospace, electronics, and structural adhesives where durability under elevated temperatures and harsh environments is required. Also utilized in the synthesis of specialty polymers and as a ligand in certain catalytic applications due to its donor properties.

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