Used as a curing agent and crosslinking agent in high-performance epoxy resins, particularly in aerospace and electronic applications due to its ability to form thermally stable and mechanically strong networks. Its rigid aromatic structure contributes to improved glass transition temperature and dimensional stability of cured resins. Also employed in the synthesis of advanced polyimides and benzoxazines for use in composites, coatings, and encapsulants requiring exceptional heat resistance and low dielectric constants. Additionally, finds application in membrane technology for gas separation owing to its well-defined molecular geometry and thermal robustness.