Used as a chelating agent in electroplating baths, particularly in nickel and cobalt plating processes. It helps stabilize metal ions in solution and improves the uniformity and quality of the deposited metal layer. Its structure allows effective complexation under acidic conditions, making it suitable for use in low-pH plating systems. Also employed in metal cleaning and pickling formulations due to its ability to dissolve metal oxides while minimizing base metal attack. Additionally, it finds use in analytical chemistry for metal ion buffering and in environmental applications for metal ion control in wastewater treatment.