Hexamethyl disilylamine (HMDS)
≥99.0%(GC)
- Product Code: 88484
Alias:
Hexamethyldisilazane; Hexamethyldisilazane, Hexamethyldisilazane
CAS:
999-97-3
| Molecular Weight: | 161.39 g./mol | Molecular Formula: | C₆H₁₉NSi₂ |
|---|---|---|---|
| EC Number: | 213-668-5 | MDL Number: | MFCD00008259 |
| Melting Point: | -78 °C | Boiling Point: | 125 °C(lit.) |
| Density: | 0.774 g/mL at 25 °C(lit.) | Storage Condition: | Room temperature, cool, filled with argon |
Product Description:
Hexamethyl disilylamine (HMDS) is widely used as a silylating agent in organic synthesis, particularly for protecting hydroxyl groups in alcohols and phenols. It is essential in the production of silicon-based polymers and resins, where it acts as a precursor or intermediate. In the semiconductor industry, HMDS is employed as an adhesion promoter in photolithography processes, enhancing the bonding of photoresist materials to silicon wafers. Additionally, it serves as a surface modifier in nanotechnology, improving the hydrophobicity of materials. Its role in gas-phase deposition processes also makes it valuable in the fabrication of thin films and coatings.
Product Specification:
| Test | Specification |
|---|---|
| COLOR TEST | 0-20 |
| PurityGC | 99 100% |
| REFRACTIVE INDEX N20D | 1.406-1.409 |
| SPECIFIC GRAVITY 2020C | 0.772-0.776 |
| APPEARANCE | COLORLESS LIQUID |
| INFRARED SPECTRUM | Conforms to Structure |
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 50.000 | 10-20 days | ฿1,260.00 |
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| 250.000 | 10-20 days | ฿2,760.00 |
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| 1000.000 | 10-20 days | ฿6,680.00 |
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| 2500.000 | 10-20 days | ฿12,980.00 |
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| 5000.000 | 10-20 days | ฿24,680.00 |
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Hexamethyl disilylamine (HMDS)
Hexamethyl disilylamine (HMDS) is widely used as a silylating agent in organic synthesis, particularly for protecting hydroxyl groups in alcohols and phenols. It is essential in the production of silicon-based polymers and resins, where it acts as a precursor or intermediate. In the semiconductor industry, HMDS is employed as an adhesion promoter in photolithography processes, enhancing the bonding of photoresist materials to silicon wafers. Additionally, it serves as a surface modifier in nanotechnology, improving the hydrophobicity of materials. Its role in gas-phase deposition processes also makes it valuable in the fabrication of thin films and coatings.
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