AG 99 is primarily used as a high-performance additive in polymer formulations, especially in engineering plastics and composite materials. It acts as a coupling agent, improving the interfacial adhesion between inorganic fillers and organic polymer matrices. This results in enhanced mechanical strength, thermal stability, and moisture resistance in the final product. It is widely applied in the manufacturing of automotive components, where durability under high temperature and mechanical stress is critical. AG 99 also finds use in electronic encapsulants and printed circuit boards due to its ability to improve dielectric properties and reduce delamination. In coatings and adhesives, AG 99 enhances adhesion to glass, metals, and ceramics, making it valuable in industrial and aerospace applications. Its reactivity allows for covalent bonding within the matrix, leading to long-term performance stability even in harsh environments.