Copper pyrophosphate hydrate
≥99%
Reagent
Code: #161705
Alias
Related CAS: 10102-90-6; Copper pyrophosphate
CAS Number
16570-28-8
science Other reagents with same CAS 16570-28-8
blur_circular Chemical Specifications
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Molecular Information
Weight
301.04 g/mol
Formula
Cu₂P₂O₇·xH₂O
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Registry Numbers
EC Number
239-250-2
MDL Number
MFCD00150225
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Storage & Handling
Storage
Room temperature
description Product Description
Used in electroplating baths to deposit smooth, adherent copper coatings on metals, especially in printed circuit board manufacturing. Provides good throwing power and uniform thickness on complex shapes. Also used in some specialty pigments and as a catalyst in organic synthesis. Stable under typical plating conditions and compatible with various additives to control grain structure and brightness.
format_list_bulleted Product Specification
| Test Parameter | Specification |
|---|---|
| Appearance | Faint Blue to Blue Powder |
| Purity (dry basis) | 99-100 |
| P2O5 % | 37.5-100 |
| Infrared Spectrum | Conforms to Structure |
| Cu (%) | 33-42 |
| Chloride (Cl) | <=0.05 |
| Sulfate (SO4) | 0-0.1 |
| Na | 0-0.3 |
| Iron (Fe) | 0-0.01 |
| Zn | 0-0.02 |
| Pb | 0-0.005 |
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