Copper(II) formate tetrahydrate

98%

Reagent Code: #161712
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Alias Copper formate, four water
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CAS Number 5893-61-8

science Other reagents with same CAS 5893-61-8

blur_circular Chemical Specifications

scatter_plot Molecular Information
Weight 225.65 g/mol
Formula (HCO₂)₂Cu•₄H₂O
badge Registry Numbers
EC Number 208-865-8
MDL Number MFCD00167128
inventory_2 Storage & Handling
Storage Room temperature, seal, dry

description Product Description

Used as a precursor in the synthesis of copper-based catalysts for organic reactions such as oxidation and coupling processes. Employed in electroplating baths to deposit copper films with controlled morphology. Serves as a reducing agent in analytical chemistry for the determination of oxidizing substances. Applied in the preparation of metal-organic frameworks (MOFs) due to its ability to coordinate with organic linkers. Also utilized in research for developing new copper-containing materials with potential applications in electronics and sensors.

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Test Parameter Specification
Appearance Blue to green Crystals or Crystalline powder
Purity 97.5-100%
Infrared Spectrum Conforms to Structure

shopping_cart Available Sizes & Pricing

Size Availability Unit Price Quantity
inventory 5g
10-20 days ฿1,180.00
inventory 25g
10-20 days ฿3,680.00
inventory 100g
10-20 days ฿13,800.00
inventory 500g
10-20 days ฿49,800.00

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Copper(II) formate tetrahydrate
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Used as a precursor in the synthesis of copper-based catalysts for organic reactions such as oxidation and coupling processes. Employed in electroplating baths to deposit copper films with controlled morphology. Serves as a reducing agent in analytical chemistry for the determination of oxidizing substances. Applied in the preparation of metal-organic frameworks (MOFs) due to its ability to coordinate with organic linkers. Also utilized in research for developing new copper-containing materials with pote

Used as a precursor in the synthesis of copper-based catalysts for organic reactions such as oxidation and coupling processes. Employed in electroplating baths to deposit copper films with controlled morphology. Serves as a reducing agent in analytical chemistry for the determination of oxidizing substances. Applied in the preparation of metal-organic frameworks (MOFs) due to its ability to coordinate with organic linkers. Also utilized in research for developing new copper-containing materials with potential applications in electronics and sensors.

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