Used primarily in electroplating processes, especially for printed circuit boards and semiconductor manufacturing, where it helps deposit uniform copper layers with high conductivity and adhesion. It serves as a source of copper ions in specialized plating baths, offering stability and consistent performance in acidic environments. Also employed in the production of certain catalysts and in industrial water treatment as a corrosion inhibitor. Its solubility and fluoride content make it useful in metal surface treatment formulations to improve coating durability and resistance to oxidation.