Used as a crosslinking agent in polymer chemistry, particularly in the synthesis of high-performance resins and thermosetting materials that offer enhanced thermal and chemical stability, as well as mechanical strength. Commonly applied in the production of specialty coatings, encapsulants, composite materials, and electronic materials where durability under high temperature and chemical exposure is required. Also serves as a comonomer in styrenic systems to improve network formation during polymerization. Additionally, utilized in photolithography systems for microelectronics manufacturing due to its excellent responsiveness to UV light, enabling precise and detailed structures.