Used as a curing agent and accelerator in epoxy resin systems, particularly in coatings, adhesives, and electronic encapsulants. It promotes rapid polymerization at elevated temperatures, offering excellent thermal stability and mechanical strength in the final product. Its structure enables good solubility in epoxy monomers and contributes to improved adhesion and chemical resistance. Commonly applied in powder coatings and composite materials where controlled reactivity and long shelf life are required. Also utilized in specialty applications such as printing inks and electrical insulation materials due to its reliable performance and low volatility.