CMF019 is primarily used in the development of advanced polymer composites for aerospace and automotive industries due to its exceptional thermal stability and mechanical strength. It acts as a cross-linking agent, enhancing the durability and heat resistance of epoxy resins. This makes it ideal for high-performance coatings, adhesives, and structural components exposed to extreme conditions. Additionally, CMF019 is employed in specialty electronics as a dielectric material, where its low moisture absorption and consistent electrical properties improve device reliability. Its compatibility with various curing systems allows for tailored formulations in industrial manufacturing processes.