XY1

10mM in DMSO

Reagent Code: #246033
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CAS Number 1624117-53-8

science Other reagents with same CAS 1624117-53-8

blur_circular Chemical Specifications

scatter_plot Molecular Information
Weight 297.35 g/mol
Formula C₁₇H₁₉N₃O₂
inventory_2 Storage & Handling
Storage -20°C

description Product Description

XY1 is widely used in industrial coating applications due to its excellent adhesion and resistance to environmental degradation. It serves as a key crosslinking agent in high-performance paints and protective finishes, especially for metal surfaces exposed to harsh conditions such as marine and automotive environments. Its ability to enhance scratch and UV resistance makes it valuable in exterior architectural coatings. In the electronics industry, XY1 is utilized in encapsulants and conformal coatings to protect circuit boards from moisture, dust, and thermal stress. It improves the durability and lifespan of electronic components under fluctuating temperatures. Additionally, XY1 is employed in adhesive formulations where strong bonding between dissimilar materials—such as plastics and metals—is required. The chemical contributes to fast curing times and high bond strength, making it suitable for assembly processes in aerospace and transportation manufacturing. Its reactivity and stability also enable use in specialty inks and printing technologies, where consistent film formation and color retention are critical.

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Size Availability Unit Price Quantity
inventory 1ml
10-20 days ฿6,990.00

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XY1
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XY1 is widely used in industrial coating applications due to its excellent adhesion and resistance to environmental degradation. It serves as a key crosslinking agent in high-performance paints and protective finishes, especially for metal surfaces exposed to harsh conditions such as marine and automotive environments. Its ability to enhance scratch and UV resistance makes it valuable in exterior architectural coatings. In the electronics industry, XY1 is utilized in encapsulants and conformal coatings to protect circuit boards from moisture, dust, and thermal stress. It improves the durability and lifespan of electronic components under fluctuating temperatures. Additionally, XY1 is employed in adhesive formulations where strong bonding between dissimilar materials—such as plastics and metals—is required. The chemical contributes to fast curing times and high bond strength, making it suitable for assembly processes in aerospace and transportation manufacturing. Its reactivity and stability also enable use in specialty inks and printing technologies, where consistent film formation and color retention are critical.
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