Used as a reactive diluent and crosslinking agent in high-performance composite materials, particularly in aerospace and electronics. It contributes to the formation of thermoset polymers with excellent thermal stability, low dielectric constant, and good mechanical strength. Commonly employed in the production of printed circuit boards and encapsulants where moisture resistance and dimensional stability are critical. Its cyanate ester functionality enables polymerization into triazine ring structures, enhancing flame resistance and reducing smoke emission in cured resins.