Bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic Acid
98%
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Used primarily as a monomer in the synthesis of specialty polymers and resins, particularly in the production of high-performance thermosetting materials. Its rigid bicyclic structure contributes to enhanced thermal stability and mechanical strength in cured polymers. Commonly employed in epoxy resin formulations where improved glass transition temperature and reduced shrinkage during curing are required. Also utilized in the development of advanced composites, coatings, and adhesives for aerospace and electronics industries due to its ability to impart excellent dielectric properties and chemical resistance. Additionally, serves as a building block in organic synthesis for creating chiral compounds in pharmaceutical and fine chemical applications.
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