Used as a reactive diluent in epoxy resin systems to reduce viscosity while maintaining reactivity, making it easier to process and apply in coatings, adhesives, and composite materials. Its functional groups enable it to participate in curing reactions, enhancing flexibility and toughness of the final product. Commonly employed in electrical encapsulation, automotive components, and industrial flooring due to improved thermal and chemical resistance. Also utilized in synthesizing specialty polymers and as a modifier in elastomers and sealants.