Used as a reactive diluent in epoxy resin systems to reduce viscosity without sacrificing performance, enabling easier processing and improved wetting of substrates. Enhances flexibility and adhesion in coatings, adhesives, and composite materials. Commonly employed in electronic encapsulants, flooring systems, and structural adhesives where deep section curing and durability are required. Also functions as a crosslinking agent in specialty polymers and can be used in the synthesis of advanced materials requiring high chemical and thermal resistance.