Used as a curing agent in high-performance epoxy resins, particularly in aerospace and electronic applications due to its ability to form thermally stable and mechanically strong networks. Its rigid, multi-cyclic structure enhances the glass transition temperature and chemical resistance of cured epoxies. Also investigated as a building block in specialty polymers and optoelectronic materials where dimensional stability and aromatic character are beneficial. Shows potential in advanced composite formulations requiring low volatility and high crosslink density.