Used as a reactive diluent in epoxy resin systems to reduce viscosity without sacrificing performance. Enhances flexibility and impact resistance of coatings, adhesives, and composites. Commonly added to improve flow and wetting properties during manufacturing of electrical encapsulants and printed circuit boards. Also utilized in UV-curable formulations due to its high reactivity with cationic photoinitiators. Provides improved adhesion to difficult substrates and contributes to chemical and heat resistance in cured networks.