Used as a curing agent in epoxy resin systems, particularly in coatings, adhesives, and electrical encapsulation. Offers low-temperature curing with extended pot life due to its latent reactivity. Provides excellent thermal and chemical resistance in the final product. Commonly applied in automotive, electronics, and industrial maintenance industries where durable, high-performance polymer networks are required. Its methoxymethyl groups enable controlled release of active amine during heating, ensuring uniform crosslinking.