THPN
≥98%(HPLC)
science Other reagents with same CAS 100079-26-3
blur_circular Chemical Specifications
description Product Description
Used as a curing agent in epoxy resin systems, particularly in high-performance coatings and electrical encapsulation. Offers excellent thermal stability and chemical resistance, making it suitable for applications in the electronics and aerospace industries. Also utilized in composite materials where durability under extreme conditions is required.
shopping_cart Available Sizes & Pricing
Cart
No products