Used primarily as a reactive diluent in epoxy resin systems, it helps reduce viscosity without sacrificing performance, making it easier to process and apply in coatings, adhesives, and composite materials. Its ability to participate in the curing reaction enhances the flexibility and toughness of the final polymer network. Commonly found in electrical encapsulants and insulation materials due to its good thermal stability and dielectric properties. Also utilized in specialty formulations where low volatility and low toxicity are required. Its bifunctional structure supports crosslinking, contributing to durable, chemically resistant end products.