Used primarily as a reactive diluent and crosslinking agent in epoxy resin systems. Enhances the mechanical properties and thermal stability of coatings, adhesives, and composites. Its vinyl and epoxy functional groups allow for dual-cure mechanisms through radical and cationic polymerization, making it suitable for UV-curable formulations. Commonly employed in electronics encapsulation, printing inks, and high-performance composite materials where improved toughness and adhesion are required. Also utilized in the synthesis of functional polymers and modified resins for specialty applications.