Neopentyl glycol diglycidyl ether
40.0%
Reagent
Code: #95131
Alias
Neopentyl glycol diglycidyl ether
CAS Number
17557-23-2
blur_circular Chemical Specifications
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Molecular Information
Weight
216.27 g/mol
Formula
C₁₁H₂₀O₄
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Registry Numbers
EC Number
241-536-7
MDL Number
MFCD00040687
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Physical Properties
Boiling Point
103-107 °C1 mm Hg(lit.)
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Storage & Handling
Density
1.04 g/mL at 25 °C(lit.)
Storage
room temperature
description Product Description
Neopentyl glycol diglycidyl ether is widely used as a reactive diluent in epoxy resin formulations. Its primary application is to reduce the viscosity of epoxy systems, making them easier to handle and process while maintaining excellent mechanical and chemical properties. This chemical is particularly valuable in coatings, adhesives, and composite materials, where it enhances flexibility and adhesion. It also contributes to improved thermal stability and resistance to environmental factors such as moisture and chemicals. In the electronics industry, it is utilized in encapsulants and potting compounds to protect sensitive components. Additionally, it finds use in the production of high-performance laminates and fiber-reinforced plastics, where it ensures optimal curing and durability.
format_list_bulleted Product Specification
Test Parameter | Specification |
---|---|
Purity (GC) | 40-100% |
Infrared Spectrum | Conforms to Structure |
Appearance | Colorless liquid |
shopping_cart Available Sizes & Pricing
Neopentyl glycol diglycidyl ether
Neopentyl glycol diglycidyl ether is widely used as a reactive diluent in epoxy resin formulations. Its primary application is to reduce the viscosity of epoxy systems, making them easier to handle and process while maintaining excellent mechanical and chemical properties. This chemical is particularly valuable in coatings, adhesives, and composite materials, where it enhances flexibility and adhesion. It also contributes to improved thermal stability and resistance to environmental factors such as moisture and chemicals. In the electronics industry, it is utilized in encapsulants and potting compounds to protect sensitive components. Additionally, it finds use in the production of high-performance laminates and fiber-reinforced plastics, where it ensures optimal curing and durability.
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