This compound is primarily utilized as a flame retardant in various polymer materials, particularly in epoxy resins and polycarbonates. Its unique structure allows it to enhance fire resistance by promoting char formation and reducing the release of flammable gases during combustion. Additionally, it is employed in the electronics industry to improve the safety of circuit boards and other components by minimizing fire hazards. Its application extends to coatings and adhesives, where it contributes to thermal stability and fire protection without significantly compromising the material's mechanical properties.