Used as a high-performance flame retardant in polymer materials, particularly in engineering plastics and electronic encapsulation resins. Its structure allows for excellent thermal stability and compatibility with matrices such as epoxy and polyamide, making it ideal for applications in printed circuit boards and semiconductor packaging. Enhances ignition resistance without compromising mechanical strength. Also employed in wire and cable insulation where low smoke emission and reduced toxicity during combustion are critical. Shows good hydrolytic stability, supporting use in humid environments.