Bisphenol A diglycidyl ether
85%
- Product Code: 143789
Alias:
2,2-bis[4-(oxidized glycidyl)phenyl]propane, 4,4'-isopropylene biphenol diglycidyl ether, BADGE, D.E.R. 332
CAS:
1675-54-3
| Molecular Weight: | 340.41 g./mol | Molecular Formula: | C₂₁H₂₄O₄ |
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| EC Number: | MDL Number: | ||
| Melting Point: | 40-44 °C | Boiling Point: | 210 °C 1mmHg |
| Density: | 1,17 g/cm3 | Storage Condition: | 2~8℃ |
Product Description:
Used primarily as a reactive diluent in epoxy resin systems to reduce viscosity and improve workability without sacrificing performance. Enhances the flow and wetting properties of epoxies, making it suitable for coatings, adhesives, and composite materials. Commonly applied in the manufacturing of electrical insulating materials, printed circuit boards, and structural adhesives due to its good adhesion and chemical resistance. Also utilized in resin formulations for aerospace and automotive industries where durability and thermal stability are required.
Sizes / Availability / Pricing:
| Size | Availability | Price | Quantity |
|---|---|---|---|
| 25.000 | 10-20 days | ฿550.00 |
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| 100.000 | 10-20 days | ฿1,290.00 |
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| 500.000 | 10-20 days | ฿4,050.00 |
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| 2500.000 | 10-20 days | ฿14,890.00 |
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Bisphenol A diglycidyl ether
Used primarily as a reactive diluent in epoxy resin systems to reduce viscosity and improve workability without sacrificing performance. Enhances the flow and wetting properties of epoxies, making it suitable for coatings, adhesives, and composite materials. Commonly applied in the manufacturing of electrical insulating materials, printed circuit boards, and structural adhesives due to its good adhesion and chemical resistance. Also utilized in resin formulations for aerospace and automotive industries where durability and thermal stability are required.
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