4,4'-Dihydroxytetraphenylmethane
≥98.0%(GC)
- Product Code: 77197
CAS:
1844-01-5
| Molecular Weight: | 352.43 g./mol | Molecular Formula: | C₂₅H₂₀O₂ |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD00045785 | |
| Melting Point: | Boiling Point: | ||
| Density: | Storage Condition: | room temperature |
Product Description:
Used primarily as a key intermediate in the synthesis of advanced polymers and resins, it contributes to the production of high-performance materials with excellent thermal stability and mechanical strength. In the electronics industry, it is utilized in the manufacture of epoxy resins, which are essential for encapsulating and protecting semiconductor devices. Additionally, it finds application in the development of adhesives and coatings, offering enhanced durability and resistance to environmental factors. Its role in creating flame-retardant materials is also noteworthy, making it valuable in safety-critical applications.
Product Specification:
| Test | Specification |
|---|---|
| APPEARANCE | White to Off White solid |
| PURITY | 98 |
| PROTON NMR SPECTRUM | Conforms to Structure |
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 1.000 | 10-20 days | ฿1,580.00 |
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| 5.000 | 10-20 days | ฿6,020.00 |
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4,4'-Dihydroxytetraphenylmethane
Used primarily as a key intermediate in the synthesis of advanced polymers and resins, it contributes to the production of high-performance materials with excellent thermal stability and mechanical strength. In the electronics industry, it is utilized in the manufacture of epoxy resins, which are essential for encapsulating and protecting semiconductor devices. Additionally, it finds application in the development of adhesives and coatings, offering enhanced durability and resistance to environmental factors. Its role in creating flame-retardant materials is also noteworthy, making it valuable in safety-critical applications.
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