Used as a reactive diluent in epoxy resin systems to reduce viscosity without sacrificing performance. Enhances flexibility and impact resistance of cured epoxy formulations. Commonly applied in coatings, adhesives, sealants, and elastomers where improved toughness and lower brittleness are required. Its hydrophobic nature contributes to better moisture resistance in final products. Also utilized in composite materials and electrical encapsulation due to its balanced reactivity and compatibility with various curing agents.