Used as a crosslinking agent in advanced epoxy resin systems, particularly in high-performance coatings and composite materials. Its dual epoxide-reactive sites enable efficient network formation, enhancing thermal stability and mechanical strength. Commonly applied in electronics encapsulation and aerospace adhesives where durability under extreme conditions is required. Also utilized in UV-curable formulations due to its ability to improve curing efficiency and reduce shrinkage. Shows promise in dental composites for improved wear resistance and reduced polymerization stress.