Poly(propylene glycol) diglycidyl ether

epoxy value:0.28-0.35 eq/100g

  • Product Code: 86267
  Alias:    α-ethylene oxide methyl-ω-ethylene oxide methoxy poly-1,2-propanediol; poly(propylene glycol) diglycidyl ether; polypropylene glycol ether; polypropylene glycol dioxirane methyl ether; - Ethylene oxide methyl-Ω-ethylene oxide methoxy poly-1,2-propylene glycol; Poly(propylene glycol) glycidyl ether
  CAS:    26142-30-3
Molecular Weight: Molecular Formula: C₃H₆OC₆H₁₀O₃
EC Number: MDL Number: MFCD00130930
Melting Point: Boiling Point:
Density: 1.14 g/mL Storage Condition: Room temperature, dry, sealed
Product Description: Poly(propylene glycol) diglycidyl ether is widely used as a reactive diluent in epoxy resin formulations. It helps to reduce the viscosity of epoxy systems, making them easier to handle and apply, particularly in coatings, adhesives, and composites. Its flexible polypropylene glycol backbone imparts improved toughness and flexibility to cured epoxy products, making it suitable for applications requiring durability and resistance to mechanical stress. Additionally, it is employed in the production of sealants and elastomers, where its epoxy functionality enables cross-linking, enhancing chemical resistance and thermal stability. In the electronics industry, it is used in encapsulants and potting compounds to protect sensitive components from environmental factors. Its compatibility with various curing agents and polymers makes it a versatile component in advanced material science applications.
Product Specification:
Test Specification
Appearance Colorless to pale yellow liquid
Infrared Spectrum Conforms to Structure
Sizes / Availability / Pricing:
Size Availability Price Quantity
2.5kg 10-20 days ฿11,800.00
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500g 10-20 days ฿3,850.00
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-
25g 10-20 days ฿660.00
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-
100g 10-20 days ฿1,950.00
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-
Poly(propylene glycol) diglycidyl ether
Poly(propylene glycol) diglycidyl ether is widely used as a reactive diluent in epoxy resin formulations. It helps to reduce the viscosity of epoxy systems, making them easier to handle and apply, particularly in coatings, adhesives, and composites. Its flexible polypropylene glycol backbone imparts improved toughness and flexibility to cured epoxy products, making it suitable for applications requiring durability and resistance to mechanical stress. Additionally, it is employed in the production of sealants and elastomers, where its epoxy functionality enables cross-linking, enhancing chemical resistance and thermal stability. In the electronics industry, it is used in encapsulants and potting compounds to protect sensitive components from environmental factors. Its compatibility with various curing agents and polymers makes it a versatile component in advanced material science applications.
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